Accession Number : AD0733369

Title :   Crack Opening Displacement and the Rate of Fatigue Crack Growth.

Descriptive Note : Scientific rept.,

Corporate Author : CONNECTICUT UNIV STORRS DEPT OF METALLURGY

Personal Author(s) : Donahue,Raymond J. ; Clark,Hector McI. ; Atanmo,Phillip ; Kumble,Raghvir ; McEvily,Arthur J.

Report Date : JUL 1971

Pagination or Media Count : 25

Abstract : Using a direct proportionality between the rate of fatigue crack growth and crack opening displacement above a threshold, it is shown that fatigue crack growth data for a wide variety of different materials can be accurately described in terms of the mechanical properties and two material constants: the constant of proportionality A and the threshold stress intensity factor K sub th. Some 65 sets of data for tests at R approximately equal to O were analyzed by computer and it is shown that the approach is valid to growth rates up to about 0.0001 in./cycle, i.e. until the onset of crack propagation by dimple formation. It is found that can be related to the yield strain for crack growth in non-aggressive environments, and is increased by increasingly severe environments, while K sub th is decreased. These changes provide a measure of the severity of the environment. Crack growth rate in non-aggressive environments is shown to be independent of the yield stress and proportional to the strain intensity factor. above the threshold. The tabulation of A and K sub th values as a function of material, environment and loading conditions provides a systematic engineering approach to estimating rates of fatigue crack growth and in determining the residual lifetimes of flawed structures. (Author)

Descriptors :   (*ALLOYS, CRACK PROPAGATION), (*CRACK PROPAGATION, FATIGUE(MECHANICS)), FRACTURE(MECHANICS), CRACKS, ALUMINUM ALLOYS, TITANIUM ALLOYS, VANADIUM ALLOYS, COPPER ALLOYS, NICKEL ALLOYS, CHROMIUM ALLOYS, MOLYBDENUM ALLOYS, COBALT ALLOYS, STEEL

Subject Categories : Metallurgy and Metallography
      Mechanics

Distribution Statement : APPROVED FOR PUBLIC RELEASE