Accession Number : AD0736790

Title :   Multi-Chip Integrated Circuit Package.

Descriptive Note : Final technical rept. 1 Jun 68-31 Aug 71,

Corporate Author : GTE LABS INC WALTHAM MASS

Personal Author(s) : Cerniglia,Nino P. ; Anderson,Kirk ; Van Buren,Ned ; DiMauro,Joe ; Ramsey,Jack

Report Date : AUG 1971

Pagination or Media Count : 270

Abstract : The objective of the contract is to reduce to practice a compatible multi-chip interconnection system for unpackaged integrated circuits, eliminating insofar as possible wire bonds and interconnection interfaces, and achieving high yield, low cost, and high reliability. A pilot production line was set up in this project to product sufficient units for test and cost evaluation. This project is based on the use of beam-leaded IC's and an air-insulated beam-lead crossover interconnection method. This is the final report on this multi-chip contract. The conclusions and recommendation sections support the basic advantages of the beam-lead system. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, *CIRCUIT INTERCONNECTIONS), MANUFACTURING, RELIABILITY(ELECTRONICS), BONDING, QUALITY CONTROL, TEST METHODS, SPECIFICATIONS

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE