Accession Number : AD0737373

Title :   Reliability of Ceramic Multilayer Boards.

Descriptive Note : Final technical rept. May 70-Jun 71,

Corporate Author : SYLVANIA ELECTRIC PRODUCTS INC WALTHAM MASS MICROELECTRONICS OPERATION

Personal Author(s) : Moore,John R. ; Furnival,Courtney ; Burt,John

Report Date : DEC 1971

Pagination or Media Count : 118

Abstract : The objective of the program was threefold: one, to bring up-to-date the current literature and information presently available in this very new packaging technology of ceramic multilayers; two, to construct a simple circuit of sufficient interwiring density that would require at least four wiring levels and a representative materials technology; and three, a test series that would create sufficient environmental stress to be able to assess the quality of the systems involved. (Author)

Descriptors :   (*PRINTED CIRCUITS, RELIABILITY(ELECTRONICS)), CERAMIC MATERIALS, SANDWICH CONSTRUCTION, CIRCUIT INTERCONNECTIONS, MICROELECTRONICS, MANUFACTURING

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE