Accession Number : AD0737885

Title :   Soldering of Gold Thin Films,

Corporate Author : FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OHIO

Personal Author(s) : Hedrig,Gaspar

Report Date : 13 DEC 1971

Pagination or Media Count : 34

Abstract : Soldering of gold thin films and of gold-plated leads to electronic components has for the past several years been of increasing interest to workers in the field. The author surveys the available literature for the theoretical and practical results and problems of recent work in the field. The phase diagram for the ternary system of gold, tin, and lead is discussed in detail, as are the conditions that generate the various phases, and the factors that affect the strength of soldered joints. Other subjects discussed include the melting and diffusion of gold in tin-lead solders, and the results of studies into the characteristics of soldered joints. (Author)

Descriptors :   (*SOLDERING, *METAL FILMS), (*CIRCUIT INTERCONNECTIONS, RELIABILITY(ELECTRONICS)), GOLD, GOLD ALLOYS, TIN ALLOYS, LEAD ALLOYS, SOLDERING ALLOYS, PHASE STUDIES, HUNGARY

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE