Accession Number : AD0745731

Title :   Polyimide Films for Hybrid Circuits.

Descriptive Note : Technical memo.,

Corporate Author : JOHNS HOPKINS UNIV SILVER SPRING MD APPLIED PHYSICS LAB

Personal Author(s) : Hicks,Robert E.

Report Date : MAY 1972

Pagination or Media Count : 47

Abstract : Polyimide films have a unique combination of properties that makes them ideally suited for hybrid and beam lead substrates. They maintain desirable chemical, electrical, and physical properties over a wide temperature range. Results of studies at APL show that these properties are advantageous in the fabrication of prototype hybrids, such as experimental amplifiers, inductors, and microwave circuits. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, HEAT RESISTANT PLASTICS), FILMS, SUBSTRATES, MICROELECTRONICS, PHYSICAL PROPERTIES

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE