Accession Number : AD0745731
Title : Polyimide Films for Hybrid Circuits.
Descriptive Note : Technical memo.,
Corporate Author : JOHNS HOPKINS UNIV SILVER SPRING MD APPLIED PHYSICS LAB
Personal Author(s) : Hicks,Robert E.
Report Date : MAY 1972
Pagination or Media Count : 47
Abstract : Polyimide films have a unique combination of properties that makes them ideally suited for hybrid and beam lead substrates. They maintain desirable chemical, electrical, and physical properties over a wide temperature range. Results of studies at APL show that these properties are advantageous in the fabrication of prototype hybrids, such as experimental amplifiers, inductors, and microwave circuits. (Author)
Descriptors : (*INTEGRATED CIRCUITS, HEAT RESISTANT PLASTICS), FILMS, SUBSTRATES, MICROELECTRONICS, PHYSICAL PROPERTIES
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE