Accession Number : AD0746275

Title :   Fracture Studies in Silicon Crystals.

Descriptive Note : Final rept. 1 Apr 71-24 Apr 72,

Corporate Author : RUTGERS - THE STATE UNIV NEW BRUNSWICK N J MATERIALS RESEARCH LAB

Personal Author(s) : Weissmann,S.

Report Date : JUL 1972

Pagination or Media Count : 10

Abstract : An X-ray diffraction method was developed to study the plastic and elastic strain distribution of a propagating crack in notched, wedge-shaped silicon crystals deformed by cantilever bending. The method is based on the disturbance of thickness contour fringes (Pendellosung fringes) of dynamically diffracting crystals by lattice defects, generated by the deformation process. The interaction of low-angle boundaries with the strain field emanting from the notch is described. (Author)

Descriptors :   (*SILICON, FRACTURE(MECHANICS)), (*CRYSTAL DEFECTS, *X RAY DIFFRACTION), (*CRACK PROPAGATION, SILICON), HIGH TEMPERATURE, STRAIN(MECHANICS), STRESSES, BENDING, METAL CRYSTALS, NOTCH SENSITIVITY

Subject Categories : Metallurgy and Metallography
      Crystallography
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE