Accession Number : AD0746315

Title :   Microcircuit Wire Bond Reliability.

Descriptive Note : Technical monograph,

Corporate Author : IIT RESEARCH INST CHICAGO ILL RELIABILITY ANALYSIS CENTER

Personal Author(s) : Myers,T. R.

Report Date : JUL 1972

Pagination or Media Count : 116

Abstract : In semiconductor devices interconnecting wire bonds have been a continuing source of reliability problems. This monograph discusses the relevance of design and processing factors to reliability problems with wire bonds. The prevention and control of such problems are discussed in terms of design, processing, post production screening and sampling tests. The current literature on the subject is reviewed and incorporated in the above discussions. An analysis of the RAC data base is presented along with the resulting bond failure rate equations and summary data. The report contains three appendices including a cross reference guide to the literature as well as bibliography of over 90 references with abstracts. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, BONDING), (*CIRCUIT INTERCONNECTIONS, *RELIABILITY(ELECTRONICS)), MICROELECTRONICS, SEMICONDUCTOR DEVICES, FAILURE(ELECTRONICS), GOLD, ALUMINUM, STATISTICAL DATA, TABLES(DATA)

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE