Accession Number : AD0749838

Title :   The Development of the Equipment and Technique for Welding the Leads of Integrated Circuits to Printed Circuit Boards,

Corporate Author : FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OHIO

Personal Author(s) : Atamanov,V. N. ; Bitsoev,G. D. ; Isaev,A. P.

Report Date : 30 JUN 1972

Pagination or Media Count : 13

Abstract : At the present time, solder with a low melting point and flux is used for attaching integrated circuits leads to printed circuit plates in industrial procedures. However, a number of difficulties are involved in this method, and there is a tendency to replace it with better welding processes such as the one proposed in this article. The basic principle here is that the voltage on the welding electrodes is automatically controlled, and the increase or decrease in the cross sections of the elements to be joined are automatically compensated by the increase or decrease in the welding current. The full schematic of the equipment is given together with details of the best use of the method for various materials to be welded. The authors conclude that this new method forms stable joints with nickel printed circuit leads. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, *CIRCUIT INTERCONNECTIONS), (*WELDING, CIRCUIT INTERCONNECTIONS), PRINTED CIRCUITS, ELECTRODES, VOLTAGE REGULATORS, USSR

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE