Accession Number : AD0750918

Title :   Multilayered Printed-Circuit Assembly,

Corporate Author : FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OHIO

Personal Author(s) : Ushakov,N. N.

Report Date : 09 AUG 1972

Pagination or Media Count : 16

Abstract : Microminiaturization cuts cost, size, and weight in electronic equipment, but all types of microminiaturization have their individual difficulties. This augments to the point where the volume of conductors to be connected almost becomes as large as the equipment. This resulted in the use of p-c boards, which can be made in many ways, a few of which are described in the report. (Author)

Descriptors :   (*PRINTED CIRCUITS, MICROELECTRONICS), RELIABILITY(ELECTRONICS), MANUFACTURING, USSR

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE