Accession Number : AD0757561

Title :   Ultrasonic Beam Lead Bonding Equipment.

Descriptive Note : Final technical rept. 10 May 71-30 Sep 72,

Corporate Author : AEROPROJECTS INC WEST CHESTER PA

Personal Author(s) : Devine,Janet

Report Date : FEB 1973

Pagination or Media Count : 29

Abstract : ED CIRCUIT DEVICE TO A SUITABLE SUBSTRATE. The design, fabrication, and evaluation of a laboratory welder for this application delineated requirements for an experimental ultrasonic beam lead bonder for field evaluation. The experimental unit consisted of a 60-kHz ultrasonic torsional welding system installed in a modified commercial micropositioner which provided x-y positioning of the beam leaded chip and incorporated an optical system with indexing for visual alignment of the chip. The welder accepts electrical power input up to about 50 watts and weld time up to 1.2 seconds; experimental data indicate this capability to be adequate for bonding commercially available beam lead devices. The process represents a practical alternative to current beam lead bonding techniques. (Author)

Descriptors :   (*ULTRASONIC WELDING, *INTEGRATED CIRCUITS), (*CIRCUIT INTERCONNECTIONS, ULTRASONIC WELDING), RELIABILITY(ELECTRONICS), ALUMINUM, MICROELECTRONICS

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE