Accession Number : AD0768142

Title :   Chip and Wire Assembly and Packaging Facilities for Prototype Microelectronic Integrated Circuits,

Corporate Author : ARMY MATERIEL COMMAND TEXARKANA TEX INTERN TRAINING CENTER

Personal Author(s) : Donnelly,James H.

Report Date : JUL 1971

Pagination or Media Count : 96

Abstract : The goal of the report is to provide a realistic and comprehensive cost estimate for two microelectronic chip and wire assembly and final packaging facilities for prototype microelectronic hybrid integrated circuits. An analysis is made of typical costs that should be anticipated for the initial installation, operation, and staffing of chip and wire assembly and packaging facilities. (Modified author abstract)

Descriptors :   (*INTEGRATED CIRCUITS, INDUSTRIAL PRODUCTION), COSTS, INDUSTRIAL EQUIPMENT, PACKAGING, LABOR, INDUSTRIAL PLANTS

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE