Accession Number : AD0777194

Title :   Reliability Study of Polyimide/Glass Multilayer Boards.

Descriptive Note : Final technical rept. Mar 72-Jun 73,

Corporate Author : MARTIN MARIETTA AEROSPACE ORLANDO FLA MATERIALS ENGINEERING LABS

Personal Author(s) : Rigling,Walter S.

Report Date : JAN 1974

Pagination or Media Count : 64

Abstract : A program was undertaken to thoroughly characterize polyimide resin thin laminate prepregs and completed multilayer boards while subjecting them to comprehensive electrical, mechanical, and environmental tests far exceeding the capabilities of other systems. The polyimide resin systems performed reliably during the tests with no evidence of degradation. It can be concluded from this program that polyimide resin, fiberglass-reinforced board materials are available that can produce multilayer printed wiring boards capable of continuous operation at over 150C and thermal cycling up to 200C without plated-through failure or degradation of electrical characteristics. These materials require no modification to existing laminating equipment or facilities. (Modified author abstract)

Descriptors :   *Circuit boards, Printed circuits, Laminates, Polyimide resins, Fiberglass, Glass reinforced plastics, Reliability(Electronics), Fabrication

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE