Accession Number : AD0780550

Title :   Infrared Testing of Multi-Layer Boards.

Descriptive Note : Final rept. 26 Sep 73-12 Jan 74,

Corporate Author : HAMILTON STANDARD WINDSOR LOCKS CONN

Personal Author(s) : Woodgate,Ralph W.

Report Date : APR 1974

Pagination or Media Count : 44

Abstract : Calculations show that quickly heating the pad surface of a plated through hole in a multi-layer printed circuit board, and plotting the time/temperature curve as the heat flows into the hole structure, will indicate the quality of the plated through hole. Limitations exist as to the degree of disconnect and the number of layers that can be tested. Experiment suggests the validity of the calculations, but shows up problems in the practical usage of the system, in particular the selection and production of effective emissivity standardization coatings. (Author)

Descriptors :   *Nondestructive testing, Infrared lasers, Thermal analysis, Test methods, Heat transmission, Infrared detectors, Holes(Openings), Sandwich construction, Emissivity, Coatings, Reliability(Electronics)

Subject Categories : Electrical and Electronic Equipment
      Test Facilities, Equipment and Methods

Distribution Statement : APPROVED FOR PUBLIC RELEASE