Accession Number : AD0782886

Title :   Bond Improvement Program for Harry Diamond Laboratories.

Descriptive Note : Final technical rept. 1 May-1 Dec 73,

Corporate Author : NORTHROP CORP PALOS VERDES PENINSULA CALIF ELECTRONICS DIV

Personal Author(s) : Sutherland,Peter G. ; Ahlport,Boyce T. ; DeMartino,Vincent

Report Date : 01 DEC 1973

Pagination or Media Count : 71

Abstract : The report covers work to improve Northrop's Nickel Beam Lead Interconnect Packaging (abbreviated as BLH for Beam Lead Hybrids in this report) materials and processing for radiation hardening. The major effort in the work established process controls, monitoring techniques and production screening techniques for BLH die attach and beam bond processes. Discrete resistor substrate materials and epoxies for component mounting were evaluated for BLH processing compatibility and radiation hardening. Component mounting techniques were improved to obtain repeatable, void-free component attachment for LSI devices. The basic bonding and material parameters for nickel beam leads were studied and a model for the ultrasonic bonding of nickel beam leads is presented, using bond monitor equipment data, bond strength data and scanning electron microscope photography. Nickel beam bond strength is established as 3 to 5 times greater than conventional flying wire. Repeatable results are achieved with the use of process controls such as bond monitoring, bond schedule optimization, material parameter control, thermal-mechanical screening and 100% nondestructive beam bond pull testing. (Modified author abstract)

Descriptors :   *INTEGRATED CIRCUITS, *CIRCUIT INTERCONNECTIONS, *BONDING, MICROELECTRONICS, MICROCIRCUITS, HYBRID CIRCUITS, MICROMINIATURIZATION, RELIABILITY(ELECTRONICS), RADIATION HARDENING, ALUMINUM, NICKEL, SUBSTRATES, ELECTRONICS, PACKAGING, CONTROL, PROCESSING, EPOXY COMPOUNDS, ULTRASONIC WELDING

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE