Accession Number : AD0783361

Title :   Fungus and Corrosion Induced Failure Mechanisms.

Descriptive Note : Final rept.,

Corporate Author : ROCKWELL INTERNATIONAL CORP ANAHEIM CALIF AUTONETICS DIV

Personal Author(s) : Brands,E. R. ; Hayashi,F. Y.

Report Date : 29 APR 1974

Pagination or Media Count : 97

Abstract : This study was undertaken to define some of the mechanisms by which electronic equipment fails in field service and storage. Circuits were assembled under different controlled conditions and then exposed to humidity, salt fog and fungus growth. The properties studied included moisture absorption, moisture transmission, insulation resistance, leakage currents and electrical parameters characteristic of specific devices. Several conformal coatings (acrylic, epoxy, polyurethane and silicone) WERE COMPARED FOR THEIR ABILITY TO MAINTAIN RELIABLE OPERATION. (Author, modified-PL)

Descriptors :   *Printed circuits, *Reliability(Electronics), Failure(Electronics), Corrosion, Fungus deterioration, Environmental tests, Coatings, Laminates, Electronic equipment, Humidity, Fog, Salts

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE