Accession Number : AD0815608
Title : THERMAL SHOCK EVALUATION OF THE MORE COMMON TYPES OF PRINTED CIRCUIT BOARD INTERFACIAL CONNECTIONS.
Descriptive Note : Technical memo.,
Corporate Author : PICATINNY ARSENAL DOVER NJ NUCLEAR ENGINEERING DIRECTORATE
Personal Author(s) : Delli Sante, Dominic R. ; Niemi, Erle N.
Report Date : JUL 1965
Pagination or Media Count : 90
Abstract : This report describes a study of the merits of various printed circuit board interfacial connections. These interfacial connections were subjected to extensive thermal shock cycling in order to determine their effectiveness. The results of this thermal shock cycling program will be utilized along with the results of other testing conducted by the Institute of Printed Circuits (IPC) in the preparation of specifications and standards for Government and Industry. The other testing programs which were conducted by the associate IPC organizations included insulation degradation and flexural fatigue. (Author)
Descriptors : *THERMAL SHOCK), (*PRINTED CIRCUITS, (*CIRCUIT INTERCONNECTIONS, THERMAL SHOCK), SPECIFICATIONS, PANEL BOARDS(ELECTRICITY), FAILURE(ELECTRONICS), PLATING, TEST METHODS.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE