Accession Number : AD0818377
Title : INVESTIGATION OF RELIABILITY TESTING AND PREDICTION TECHNIQUES FOR INTEGRATED CIRCUITS.
Descriptive Note : Final rept. 19 Apr 65-19 Oct 66,
Corporate Author : TEXAS INSTRUMENTS INC DALLAS
Personal Author(s) : Fewer, D. R. ; Gill, W. L. ; Musket, S. F. ; Workman, W. L.
Report Date : JUN 1967
Pagination or Media Count : 190
Abstract : The work is divided into four parts: (1) data analysis and preliminary tests to determine failure mechanisms for early direction in the study; (2) a physics of failure program consisting of fundamental oxide studies, metal contact and interconnection evaluations, and circuit analysis; (3) a test program including data and failure analysis and consisting of two major segments; and (4) the development of a reliability screening procedure for integrated circuits. Three computer programs, SERF, LINDA 1 and LINDA 2 were written to assist in the analysis of data. The physics of failure program consisted of fundamental surface studies to produce stable metal-oxide-silicon (MOS) systems, circuit analysis of the SN5420 integrated circuit, and a study of the molybdenum-gold expanded contact system. (Author)
Descriptors : *RELIABILITY(ELECTRONICS)), (*INTEGRATED CIRCUITS, (*FAILURE(ELECTRONICS), INTEGRATED CIRCUITS), (*NONDESTRUCTIVE TESTING, INTEGRATED CIRCUITS), SANDWICH CONSTRUCTION, COMPOSITE MATERIALS, METALS, OXIDES, SILICON, MOLYBDENUM, GOLD, COMPUTER PROGRAMS, TRANSIENTS, STRESSES, BONDING, ADHESION, ELECTRIC CONNECTORS, EXPERIMENTAL DATA, GRAPHICS.
Subject Categories : Electrical and Electronic Equipment
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE