Accession Number : AD0819192
Title : TECHNIQUES FOR THE CONTROL OF INTEGRATED CIRCUIT QUALITY AND RELIABILITY VOLUME II - APPENDICES.
Descriptive Note : Final rept. 1 Jul 65-14 Apr 67,
Corporate Author : GENERAL ELECTRIC CO SYRACUSE NY SEMICONDUCTOR PRODUCTS DEPT
Personal Author(s) : Herr, Erwin A.
Report Date : JUN 1967
Pagination or Media Count : 317
Abstract : This is a program directed to establish techniques for the control of integrated circuit quality and reliability. The primary objective of this program was to investigate a method to monitor integrated circuit fabrication which would provide information about the quality and reliability of the device. The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semiconductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits.
Descriptors : *RELIABILITY(ELECTRONICS)), (*INTEGRATED CIRCUITS, (*QUALITY CONTROL, INTEGRATED CIRCUITS), STATISTICAL ANALYSIS, STRESSES, TEST METHODS, DIFFUSION, PERFORMANCE(ENGINEERING), ACCELERATED TESTING, COMPUTERS, COMPUTER PROGRAMS, REGRESSION ANALYSIS, FAILURE(ELECTRONICS), VIBRATION, TEMPERATURE, STABILITY.
Subject Categories : Electrical and Electronic Equipment
Test Facilities, Equipment and Methods
Distribution Statement : APPROVED FOR PUBLIC RELEASE