Accession Number : AD0820250
Title : MANUFACTURING IN-PROCESS CONTROL AND MEASURING TECHNIQUES FOR INTEGRAL ELECTRONICS.
Descriptive Note : Final technical rept. 1 Feb 64-31 Jan 66,
Corporate Author : MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP
Personal Author(s) : Metz, E. D. ; Wolkins, D. O.
Report Date : APR 1967
Pagination or Media Count : 354
Abstract : The primary objective of this contract is to generate a system of nondestructive testing procedures for the entire series of processing steps used in the fabrication of semiconductor devices. The tests are intended to be of such a nature that they will find general applicability to a class of semiconductor processes common to ordinary devices such as transistors and diodes, semiconductor and compatible integrated circuits, and passive thin film components. The importance of such tests is becoming increasingly clear as the technology proceeds toward devices which are constructed in such a way as to place increasing stress and importance on yield factors. Such devices include extremely high frequency elements whose tight dimensional tolerances place critical demands on the process large area devices, such as high frequency power transistors or large integrated circuits which suffer yield losses by virtue of their size. It is not the primary objective of this contract to develop new processes which will enhance these yield factors, but rather to develop sophisticated measurement techniques at each stage of the process which will delineate the basic yield degradations at each stage. (Author)
Descriptors : *QUALITY CONTROL), (*SEMICONDUCTOR DEVICES, NONDESTRUCTIVE TESTING), (*MANUFACTURING, EPITAXIAL GROWTH, DOPING, THICKNESS, DIFFUSION, ELECTRICAL RESISTANCE, PHOTOGRAPHY, MASKING, ETCHING, OXIDES, FILMS, INFRARED SPECTROSCOPY, ELECTRON MICROSCOPY, INTEGRATED CIRCUITS, TRANSISTORS.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE