Accession Number : AD0840289

Title :   INVESTIGATION OF HEAT REMOVAL FROM BOTH SIDES OF A TRANSISTOR CHIP EMBODYING BUMP TECHNOLOGY.

Descriptive Note : Final rept. May 67-Jun 68,

Corporate Author : HUGHES AIRCRAFT CO NEWPORT BEACH CA MICROELECTRONICS LAB

Personal Author(s) : Rueffer, H. E.

Report Date : SEP 1968

Pagination or Media Count : 53

Abstract : The purpose of the work was to determine the feasibility of removing heat simultaneously from both the collector and emitter sides of a double diffused transistor chip. The work consisted of forming a large silver bump over the emitter and a small bump for base contact on the front side of a power transistor chip. This chip was mounted face down on a modified TO-60 header and a large silver strap was used to contact the collector on the back side. A non-multiple emitter structure mounted as above showed a 40% decrease in thermal resistance over a chip mounted face up in a standard manner. (Author)

Descriptors :   (*TRANSISTORS, COOLING), FEASIBILITY STUDIES, SILICON, HEAT TRANSFER, SILVER, THERMAL PROPERTIES.

Subject Categories : Electrical and Electronic Equipment
      Thermodynamics

Distribution Statement : APPROVED FOR PUBLIC RELEASE