Accession Number : AD0840576
Title : MEMORY SYSTEM FOR MICROCIRCUITS.
Descriptive Note : Final rept. 1 May 66-15 Dec 67,
Corporate Author : SPERRY RAND CORP PHILADELPHIA PA UNIVAC DIV
Personal Author(s) : Weilerstein, Marvin I.
Report Date : AUG 1968
Pagination or Media Count : 187
Abstract : A program to design and develop manufacturing processes for a compact, low power, modular memory is described. The memory uses electroplated magnetic film storage elements, vacuum evaporated wiring and insulation, integrated circuits ultrasonically face-down bonded to evaporated wiring, and welded copper-Mylar tape interconnections. Design, fabrication, and test of the memory is reported. Manufacturing processes and equipment are described for magnetic film plating, vacuum evaporation, face-down bonding, and copper-Mylar tape welding. Development of a set of integrated selection and recirculation circuits is reported. (Author)
Descriptors : *THIN FILM STORAGE DEVICES), (*DATA STORAGE SYSTEMS, INTEGRATED CIRCUITS, VAPOR PLATING, VACUUM APPARATUS, BONDING, ULTRASONIC WELDING, POLYESTER PLASTICS, COPPER, FILMS, ELECTRODEPOSITION, ETCHING, MANUFACTURING.
Subject Categories : Fabrication Metallurgy
Distribution Statement : APPROVED FOR PUBLIC RELEASE