Accession Number : AD0844325

Title :   Ultrasonic Face Bond Reliability Study

Descriptive Note : Final technical rept. Nov 1966-Jun 1968

Corporate Author : AUTONETICS ANAHEIM CA

Personal Author(s) : Hogan, B T ; Scudder, N F ; Kinan, A M ; Schmoyer, W A ; Gross, Jr, A G

PDF Url : AD0844325

Report Date : Oct 1968

Pagination or Media Count : 116

Abstract : The report discusses a program concerned with the effect of ultrasonic bonding energy on the oxide coating of integrated circuit chips; to experimentally determine the optimum face-bonded assembly design; and to fabricate and test a number of the 'practical best' assemblies.

Descriptors :   *INTEGRATED CIRCUITS, AGING(MATERIALS), DEFECTS(MATERIALS), ELECTRICAL PROPERTIES, FILMS, MANUFACTURING, METALLOGRAPHY, PHOTOMICROGRAPHY, SILICON, THERMAL STABILITY, THERMAL STRESSES, ULTRASONIC WELDING, VISUAL INSPECTION

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE