Accession Number : AD0844325

Title :   Ultrasonic Face Bond Reliability Study.

Descriptive Note : Final technical rept. Nov 66-Jun 68,

Corporate Author : AUTONETICS ANAHEIM CA

Personal Author(s) : Hogan, B. T. ; Scudder, N. F. ; Kinan, A. M. ; Schmoyer, W. A. ; Gross, A. G., Jr

Report Date : OCT 1968

Pagination or Media Count : 112

Abstract : The report discusses a program concerned with the effect of ultrasonic bonding energy on the oxide coating of integrated circuit chips; to experimentally determine the optimum face-bonded assembly design; and to fabricate and test a number of the 'practical best' assemblies. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, MANUFACTURING), ULTRASONIC WELDING, FILMS, THERMAL STABILITY, DEFECTS(MATERIALS), PHOTOMICROGRAPHY, THERMAL STRESSES, VISUAL INSPECTION, METALLOGRAPHY, AGING(MATERIALS), SILICON, ELECTRICAL PROPERTIES.

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE