Accession Number : AD0844883
Title : UHF Film Integrated Circuits.
Descriptive Note : Quarterly rept. no. 1, 1 Jun-31 Aug 68,
Corporate Author : RCA LABS PRINCETON NJ
Personal Author(s) : Caulton, Martin ; Hershenov, Bernard ; Napoli, Louis S. ; Schnitzler, Paul ; Siekanowicz, Wieslaw W.
Report Date : NOV 1968
Pagination or Media Count : 55
Abstract : The purpose of this project is to investigate lumped-element vs. microstrip circuitry for use at microwave frequencies (up to X-band), with highpower active devices, and as transforming networks between radically different impedances. Requirements for high-quality integrated lumped elements and microstrip transmission lines are discussed. Besides the standard Cu and Au evaporation of conductors, at least one skin depth of W and Mo has been successfully sputtered and vapor-deposited on sapphire. Characteristics of several glasses have been studied, and techniques to obtain densified glasses with low dielectric losses have been improved. Various integrated systems involving metal-dielectric-metal sandwiches have been tried, and a gold-glass-copper-gold sandwich has been found to be a satisfactory compromise. The loss measurements of networks, utilizing the scattering-coefficient method (Deschamps), are described. A resonance measurement to study lumped elements at S- to X-band frequencies is analyzed; lumped-element inductors remain truly lumped up to at least 6 GHz. Performance of uncoupled microstrip lines in the form of filters, branch-line couplers, and phase shifters is described. Directional couplers have been designed and fabricated, and measurements on coupled lines have been made to determine the even- and odd-mode characteristics. Preliminary results on the operation of a microstrip quadrupler (1.77 to 7.08 GHz), at 1.6 watts with 28% efficiency are reported. (Author)
Descriptors : *THIN FILM STORAGE DEVICES), (*INTEGRATED CIRCUITS, ULTRAHIGH FREQUENCY, STRIP TRANSMISSION LINES, GOLD, GLASS, PHASE SHIFT CIRCUITS, DIELECTRICS, LOW PASS FILTERS, CAPACITORS, ETCHING, DEPOSITION, SUBSTRATES, MOLYBDENUM, COPPER, MICROWAVE FREQUENCY, MANUFACTURING, S BAND, X BAND, VAPOR PLATING, VACUUM APPARATUS, TUNGSTEN, SAPPHIRE, SANDWICH CONSTRUCTION, IMPEDANCE MATCHING, SPUTTERING, SEMICONDUCTOR DEVICES.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE