Accession Number : AD0846675

Title :   The KME-3 Technology -- An Economical Variant for the Preparation of Thin-Layer Hybrid Circuits,

Corporate Author : FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OH

Personal Author(s) : Schleicher, E. ; Thieme, O. ; Henneberger, J. ; Schiller, S. ; Heisig, U.

Report Date : 21 FEB 1968

Pagination or Media Count : 19

Abstract : In order to make possible the application of hybrid thin-film switching circuits, the Hermsdorf Ceramic Works (East Germany) has developed a relatively simple and economical procedure, termed the KME-3 technique, for fabricating integrated switching circuits. The necessary manufacturing equipment, which is described briefly, was designed and built by the Manfred von Ardene Research Institute in Dresden. In this procedure, an NiCr resistive film is first deposited on a clean glass substrate by evaporation (glass substrates are used rather than ceramic ones because of their lower cost). Then, in a second evaporation process, interconnections are deposited. After being separated from the substrate, the interconnections are tin-plated, the leads are attached, and the active elements (i.e. transistors) are installed. Finally, the circuit is encapsulated and its switching function is measured. If they are required, discrete capacitors are deposited by evaporation. Generally, the electrodes are made from special Fe alloys. Circuit diagrams illustrating some practical circuit configurations are given. (Author)

Descriptors :   (*SWITCHING CIRCUITS, INTEGRATED CIRCUITS), (*INTEGRATED CIRCUITS, MANUFACTURING), FILMS, NICKEL ALLOYS, CHROMIUM ALLOYS, IRON ALLOYS, SILICON COMPOUNDS, MONOXIDES, DIELECTRICS, GLASS, SUBSTRATES, VAPOR PLATING, CIRCUIT INTERCONNECTIONS, TIN COATINGS, ENCAPSULATION, EAST GERMANY.

Subject Categories : Electrical and Electronic Equipment
      Ceramics, Refractories and Glass
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE