Accession Number : AD0846723

Title :   Quality Defects in Integrated Circuits.

Descriptive Note : Final technical rept. 29 Mar 67-29 Jul 68,

Corporate Author : PHILCO-FORD CORP BLUE BELL PA MICROELECTRONICS DIV

Personal Author(s) : Gott, Peter ; Soltau, Richard

Report Date : DEC 1968

Pagination or Media Count : 153

Abstract : The study was conducted in order to identify and classify processing defects observed in integrated circuits, and to determine the relative importance of these defects in terms of product reliability. Its primary concern has been with defects induced during wafer processing and subsequent operations, such as electrical die sort, scribing, and bonding. The study had, as a corollary objective, the development of effective screens to segregate circuits containing these defects, without impairing the quality of the resulting set of devices designated for ultimate usage in the end product. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, RELIABILITY(ELECTRONICS)), DEFECTS(MATERIALS), FAILURE(ELECTRONICS), VISUAL INSPECTION, QUALITY CONTROL, PROCESSING.

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE