Accession Number : AD0850187
Title : UHF Film Integrated Circuits.
Descriptive Note : Quarterly rept. no. 2, 1 Sep-30 Nov 68,
Corporate Author : RCA LABS PRINCETON NJ
Personal Author(s) : Caulton, Martin ; Hershenov, Bernard ; Knight, Stanley P. ; Napoli, Louis S. ; Schnitzler, Paul
Report Date : APR 1969
Pagination or Media Count : 38
Abstract : The purpose of this project is to investigate lumped-element vs. microstrip circuitry for use (1) at microwave frequencies (up to X-band), (2) with high-power active devices, and (3) as transforming networks between radically different impedances. Further work on glass dielectric quality was pursued this quarter, and the dielectric loss was lowered by densification. Integrated metal-dielectric-metal sandwiches compatible with the glass processing were studied. Further utilization of the scattering-coefficient method to measure the loss of networks is described. The resonance technique has been used to measure the reactance and quality of lumped elements. The performance of breadboard lumped-element directional couplers and filters is presented, and designs for integrated versions are described. Data on the dispersion characteristics of microstrip lines (frequency dependence of phase velocity and characteristic admittance) are presented. Further work has yielded nearly 1.5 watts at 9.0 GHz with as much as 28% efficiency and 5% bandwidth on the Integrated S- to X-Band Quadrupler.
Descriptors : (*INTEGRATED CIRCUITS, ULTRAHIGH FREQUENCY), FILMS, POWER AMPLIFIERS, BANDWIDTH, RADIOFREQUENCY POWER, ELECTRICAL IMPEDANCE, DIELECTRICS, GLASS, PHASE SHIFT CIRCUITS, FREQUENCY MULTIPLIERS, CAPACITORS, TRANSMISSION LINES, METALS, MICROWAVE FREQUENCY, S BAND, X BAND, SILICON DIOXIDE, MANUFACTURING, RADIOFREQUENCY FILTERS, SANDWICH CONSTRUCTION.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE