Accession Number : AD0853208
Title : Assymmetrical Microstrip IC Structures.
Descriptive Note : Quarterly interim engineering rept. 15 Jan-15 Apr 69,
Corporate Author : GENERAL ELECTRIC CO SYRACUSE NY ELECTRONICS LAB
Personal Author(s) : Beebe, Wilbert L. ; Domer, Frederick R. ; Kyle, Robert H. ; Chang, Yu ; Nielsen, Edward G.
Report Date : 21 MAY 1969
Pagination or Media Count : 48
Abstract : Double ground plane structures were analyzed and their characteristic transmission line impedance was determined. Analysis was somewhat more involved than that for conventional microstrip because of the two-dielectric system employed in double ground plane structures. Analysis techniques and design equations are provided. Design curves useful for microwave applications of the structures were generated by a computer program and conclusions were reached regarding properties of the transmission medium. The design curves show the relationship between conductor line width and dielectric thickness. An error analysis was performed and error curves showing the effect of varying conductor line width and dielectric thicknesses are provided. Double ground plane structures were fabricated in order to obtain the necessary thickness control on the fluorinated ethylene propylene (FEP) layers to provide suitable control of microwave parameters. Thickness control was achieved and is described. The metal mesas, which provide electrical connections between the FEP layers, will be developed next. Proposed approaches were outlined for controlling mesas height and dimensional thickness control of the FEP when mesas are employed. (Author)
Descriptors : (*INTEGRATED CIRCUITS, WAVEGUIDE COUPLERS), MICROWAVE EQUIPMENT, FILMS, SUBSTRATES, ELECTRICAL IMPEDANCE, DIELECTRICS, MANUFACTURING.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE