Accession Number : AD0855278

Title :   Thermal Parameters and Analytical-Experimental Procedures for Integrated Circuit Devices and Systems.

Descriptive Note : Phase rept.,

Corporate Author : NAVAL AIR DEVELOPMENT CENTER WARMINSTER PA AERO-ELECTRONIC TECHNOLOGY DEPT

Personal Author(s) : Plizak, B. T.

Report Date : 05 MAY 1969

Pagination or Media Count : 99

Abstract : Results of studies of thermal considerations in integral circuit (IC) devices and systems is presented. Covered are IC thermal parameters, thermal instrumentation and temperature measuring techniques, computer implemented thermal analyses, magnitudes of thermal gradients and thermal resistances, design considerations for a high dissipation-low thermal resistance IC package, IC package to sink thermal analyses, and an IC thermal alarm system. The information presented should be of use to both the user and the manufacturer of integrated circuits. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, THERMAL ANALYSIS), MICROELECTRONICS, THERMAL PROPERTIES, HEAT RESISTANT MATERIALS, HEAT SINKS, INTERFACES, PRINTED CIRCUITS, TEMPERATURE WARNING SYSTEMS, FEASIBILITY STUDIES, HEAT TRANSFER.

Subject Categories : Electrical and Electronic Equipment
      Thermodynamics

Distribution Statement : APPROVED FOR PUBLIC RELEASE