Accession Number : AD0858178
Title : Evaluation of Selected Three Layer Thin Films for Compatibility with Hybrid Microelectronic Fabrication Techniques.
Descriptive Note : Technical rept.,
Corporate Author : NAVAL AVIONICS FACILITY INDIANAPOLIS IN
Personal Author(s) : Higbie, Thomas E.
Report Date : 09 JUN 1969
Pagination or Media Count : 22
Abstract : The report evaluates several types of three layer thin films for compatibility with standard microelectronic interconnection techniques. Specifically, it was determined if any of the materials used as intermediate layers were capable of functioning as a diffusion barrier at the elevated temperatures required for eutetic die mounting and thermocompression wire bonding. (Author)
Descriptors : (*INTEGRATED CIRCUITS, MANUFACTURING), (*CIRCUIT INTERCONNECTIONS, FILMS), MICROELECTRONICS, COMPATIBILITY, ULTRASONIC WELDING, RESISTANCE WELDING, BONDING.
Subject Categories : Electrical and Electronic Equipment
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE