Accession Number : AD0871408
Title : Improving Strip-Line Packages by the Use of Bonding Techniques,
Corporate Author : NAVAL WEAPONS CENTER CHINA LAKE CA
Personal Author(s) : May, Charles B.
Report Date : JUN 1970
Pagination or Media Count : 53
Abstract : The potential advantages and disadvantages of bonding strip transmission lineboards together are outlined. An approach for bonding Teflon-fiberglass board material is described and evaluated. Bonding of multilayer and multideck stripline sandwiches is discussed. Principal areas which need to be examined in the future are outlined. (Author-PL)
Descriptors : *BONDING), (*STRIP TRANSMISSION LINES, CIRCUITS, SANDWICH CONSTRUCTION, SUBSTRATES, REINFORCED PLASTICS, HALOCARBON PLASTICS, GLASS TEXTILES, PACKAGING.
Subject Categories : Electrical and Electronic Equipment
Laminates and Composite Materials
Distribution Statement : APPROVED FOR PUBLIC RELEASE