Accession Number : AD0877310

Title :   Beam Lead Reliability.

Descriptive Note : Final technical rept. Mar 69-Jul 70,

Corporate Author : GENERAL TELEPHONE AND ELECTRONICS LABS INC WOBURN MA

Personal Author(s) : Fitzgerald, Thomas W.

Report Date : OCT 1970

Pagination or Media Count : 57

Abstract : A study of the performance of over 16,000 Beam Lead Bonds, used to connect semiconductor devices to external circuitry, was completed. The performance of this now relatively wide-spread connection technique, after exposure to severe mechanical and thermal environments, is shown to be very reliable, with occumulated failures affecting practical device performance of less than 0.58%. Even these failures could probably have been eliminated if a screening similar to the conventional semiconductor 'Burn-in' test could have been incorporated. The causes and natures of failures observed are discussed. The mechanical strength of a large sample of bonds is also investigated. (Author)

Descriptors :   *BONDING), (*ELECTRIC CONNECTORS, (*SEMICONDUCTOR DEVICES, ELECTRIC CONNECTORS), RELIABILITY(ELECTRONICS), FAILURE(ELECTRONICS), ENVIRONMENTAL TESTS, GOLD.

Subject Categories : Electrical and Electronic Equipment
      Couplers, Fasteners, and Joints

Distribution Statement : APPROVED FOR PUBLIC RELEASE