Accession Number : AD0881232

Title :   Production Engineering Measure for Solid Encapsulated Semiconductor Devices.

Descriptive Note : Quarterly rept. no. 3, 14 Jul-13 Oct 70,

Corporate Author : TRW SEMICONDUCTORS LAWNDALE CA

Personal Author(s) : Smolker, Gary

Report Date : NOV 1970

Pagination or Media Count : 48

Abstract : Over six hundred parts have been tested for a pressure cooker test and a temperature cycle test. Over fifty percent of the tested parts failed the pressure cooker screening test. Fourteen percent of the tested parts failed the temperature cycle test. Aluminaborosilicate passivated transistors molded with epoxy resin, parylene passivated transistors molded with silicone resin, and GE602 RTV passivated transistors molded with silicone are investigated. A review of experimental data on the junction coating materials and molding materials are presented. (P.S.-PL)

Descriptors :   (*TRANSISTORS, MANUFACTURING), ENCAPSULATION, ENVIRONMENTAL TESTS, MOLDINGS, EMBEDDING SUBSTANCES, EPOXY RESINS, SILICONE PLASTICS, PHENOLIC PLASTICS.

Subject Categories : Electrical and Electronic Equipment
      Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE