Accession Number : AD0881446

Title :   Product Engineering Measure, Solid Encapsulated Semiconductor Devices.

Descriptive Note : Quarterly progress rept. no. 3, 1 Jul-1 Oct 70,

Corporate Author : MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP

Personal Author(s) : Karasch, Robert J. ; Christensen, Robert E.

Report Date : NOV 1970

Pagination or Media Count : 52

Abstract : The objective of this production engineering measure is to develop theproduction capacity to produce small signal plastic transistors capable ofqualifying for military application. The passivation techniques used duringchip fabrication and the assembly scheme used to encapsulate the chips areinvestigated. The performance of present commercial chips in siliconeencapsulant utilizing SiO2 passivation are listed in detail. The comparisonbetween Si3N4 and SiO2 passivation is included. The effects of assemblyclean procedures versus a wafer clean or steam getter procedure are investigated.High purity, solventless silicone resins are evaluated for use in semiconductorjunction coating. Typical properties of these resins in the cured state aregiven. (S.M.-PL)

Descriptors :   (*TRANSISTORS, MANUFACTURING), SILICON, ENCAPSULATION, SILICONE PLASTICS, PRODUCTION CONTROL, MILITARY REQUIREMENTS.

Subject Categories : Electrical and Electronic Equipment
      Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE