Accession Number : AD0892496
Title : Production Engineering Measure Solid Encapsulated Semiconductor Devices.
Descriptive Note : Quarterly progress rept. no. 8, 1 Oct 71-1 Jan 72,
Corporate Author : MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP
Personal Author(s) : Donnally, Leroy C. ; Wright, James C.
Report Date : 01 JAN 1972
Pagination or Media Count : 49
Abstract : The objective of this report is to develop the production capacity to produce small signal plastic transistors capable of qualifying for military applications. A COMPARISON OF TWO TYPES OF WAFER PASSIVATION IS DISCUSSED. A comparison of two methods of device surface cleaning is also reported. Various assembly methods are described. (P.S.-PL)
Descriptors : (*TRANSISTORS, ENCAPSULATION), MANUFACTURING, SUBSTRATES, SILICON DIOXIDE, SILICONES, PLASTICS, SILICON COMPOUNDS, DIFFUSION, ETCHING, NITRIDES, LEAKAGE(ELECTRICAL), EVAPORATION, CLEANING, ALUMINUM, DEGASIFICATION, FAILURE(ELECTRONICS), MOLDINGS, TITANIUM, PLATINUM, GOLD.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE