Accession Number : AD0892496

Title :   Production Engineering Measure Solid Encapsulated Semiconductor Devices.

Descriptive Note : Quarterly progress rept. no. 8, 1 Oct 71-1 Jan 72,

Corporate Author : MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP

Personal Author(s) : Donnally, Leroy C. ; Wright, James C.

Report Date : 01 JAN 1972

Pagination or Media Count : 49

Abstract : The objective of this report is to develop the production capacity to produce small signal plastic transistors capable of qualifying for military applications. A COMPARISON OF TWO TYPES OF WAFER PASSIVATION IS DISCUSSED. A comparison of two methods of device surface cleaning is also reported. Various assembly methods are described. (P.S.-PL)

Descriptors :   (*TRANSISTORS, ENCAPSULATION), MANUFACTURING, SUBSTRATES, SILICON DIOXIDE, SILICONES, PLASTICS, SILICON COMPOUNDS, DIFFUSION, ETCHING, NITRIDES, LEAKAGE(ELECTRICAL), EVAPORATION, CLEANING, ALUMINUM, DEGASIFICATION, FAILURE(ELECTRONICS), MOLDINGS, TITANIUM, PLATINUM, GOLD.

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy
      Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE