Accession Number : AD0892498

Title :   Microcircuit Bond Screening Study.

Descriptive Note : Final technical rept.,

Corporate Author : RAYTHEON CO SUDBURY MA

Personal Author(s) : Gaffney, John ; Bonomi, Bennie

Report Date : DEC 1971

Pagination or Media Count : 108

Abstract : A study was undertaken to determine if any standard or nonstandard environment would provide an effective screen to remove weak bonds from integrated circuits. Both flat packages and dual-in-line packages were considered. All of the devices utilized .001 in. dia. aluminum wire, ultrasonically bonded to chip and post. The results indicated that package disintegration precedes bond detachment, even when bonds are only lightly attached. It is concluded, based on the results obtained from this study, that none of the environments used provided a totally effective screen for weak ultrasonic bonds.

Descriptors :   (*INTEGRATED CIRCUITS, TEST METHODS), (*ULTRASONIC WELDING, TEST METHODS), SEMICONDUCTORS, ALUMINUM, LASERS, FAILURE(ELECTRONICS), ELECTRON BEAMS, CONTAMINATION, QUALITY CONTROL, THERMAL PROPERTIES, PULSES, SAWS, TENSILE PROPERTIES, SEMICONDUCTOR DEVICES, STRESSES, BONDING, ENVIRONMENTAL TESTS, ACCELERATION, SHOCK(MECHANICS), CERAMIC MATERIALS, ULTRASONIC RADIATION, ELECTRIC WIRE.

Subject Categories : Electrical and Electronic Equipment
      Ceramics, Refractories and Glass
      Fabrication Metallurgy
      Test Facilities, Equipment and Methods

Distribution Statement : APPROVED FOR PUBLIC RELEASE