Accession Number : AD0905769
Title : Production Engineering Measure, Solid Encapsulated Semiconductor Devices.
Descriptive Note : Quarterly progress rept. nos. 9 and 10, 1 Jan-1 Sep 72,
Corporate Author : MOTOROLA INC PHOENIX AZ SEMICONDUCTOR GROUP
Personal Author(s) : Donnally, LeRoy C. ; Wright, James C.
Report Date : 01 SEP 1972
Pagination or Media Count : 52
Abstract : The purpose of this PEM is to develop the production capacity and processing methods necessary to produce a plastic encapsulated small signal transistor capable of qualifying for military applications. The program planned for this PEM will concentrate on three aspects of transistor manufacture; i.e., passivation techniques with standard aluminum front metal used during chip fabrication, a new titanium platinum gold front metal system, and various assembly schemes to optimize encapsulation of the chips. To illustrate the proposed development scheme, Block Diagram of PEM Manufacturing Techniques, has been included.
Descriptors : (*TRANSISTORS, MANUFACTURING), ENCAPSULATION, PLASTICS, SILICON DIOXIDE, SILICON COMPOUNDS, NITRIDES, ALUMINUM, GOLD, PLATINUM, PRODUCTION CONTROL, DIES, MILITARY REQUIREMENTS, SILICONES.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE