Accession Number : AD0918501

Title :   Multilayer Interconnections for Hybrid Microcircuits.

Descriptive Note : Final rept. Jul 70-Feb 72,

Corporate Author : SYLVANIA ELECTRIC PRODUCTS INC WALTHAM MA MODULE OPERATIONS

Personal Author(s) : Moore, John R.

Report Date : APR 1974

Pagination or Media Count : 146

Abstract : This program covered an investigation of the failure modes and mechanisms for two types of ceramic multilayer substrates mounted within a hermetic package; and the development of suitable tests which were modified and are submitted as recommendations for the evaluation and/or qualification testing of high reliability substrates. The technical guidelines for the contract specify the two types of test substrates as follows: (1) Thick Film Multilayer Conductor System composed of successive layers of screened conductors and dielectrics, and (2) Homogeneous Metal-Ceramic Multilayer System composed of individual layers of green ceramic, each layer having a conductor pattern. These layers are stacked and fired simultaneously to form a monolithic metal-ceramic multilayer structure.

Descriptors :   *HYBRID CIRCUITS, *PRINTED CIRCUITS, *SUBSTRATES, CIRCUIT INTERCONNECTIONS, THICK FILMS, CERAMIC MATERIALS, INTEGRATED CIRCUITS, HEAT TREATMENT, RELIABILITY(ELECTRONICS), SINTERING FURNACES, DEPOSITION, MANUFACTURING, DIELECTRIC FILMS, THERMAL STABILITY, SHOCK RESISTANCE, ACCELERATION, METAL FILMS, BONDING, MICROCIRCUITS.

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE