Accession Number : ADA017444
Title : Thermal Resistance of Microelectronic Packages. Part 1. Recommended Method 1012 (Thermal Characteristics) for MIL-STD-883. Part 2. Summary of Analyses and Experimental Data for Thermal Test Packages and MIL-M-38510 Packages.
Descriptive Note : Final rept. 15 Feb 74-14 Mar 75,
Corporate Author : GENERAL ELECTRIC CO SYRACUSE N Y ELECTRONICS LAB
Personal Author(s) : Baxter,Gene K. ; Brouillette,J. Walter
Report Date : AUG 1975
Pagination or Media Count : 106
Abstract : Methods for measurement of thermal resistance and response curves, including MIL-STD-883 Method 1012, were evaluated to determine an optimum method to measure MIL-M-38510 packages. Computer simulation, IR and electrical measurements were evaluated and compared for special thermal test packages. A ratio of about 5:1 was shown to exist for the junction peak, average and region temperature rise. Measurements can be misleading without proper interpretation. The optimum method, IR measurement of a coated chip, can measure only the junction region thermal resistance.
Descriptors : *Packaged circuits, Microelectronics, Microcircuits, Integrated circuits, Thermal resistance, Thermal properties, Response, Junctions
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE