Accession Number : ADA017444

Title :   Thermal Resistance of Microelectronic Packages. Part 1. Recommended Method 1012 (Thermal Characteristics) for MIL-STD-883. Part 2. Summary of Analyses and Experimental Data for Thermal Test Packages and MIL-M-38510 Packages.

Descriptive Note : Final rept. 15 Feb 74-14 Mar 75,

Corporate Author : GENERAL ELECTRIC CO SYRACUSE N Y ELECTRONICS LAB

Personal Author(s) : Baxter,Gene K. ; Brouillette,J. Walter

Report Date : AUG 1975

Pagination or Media Count : 106

Abstract : Methods for measurement of thermal resistance and response curves, including MIL-STD-883 Method 1012, were evaluated to determine an optimum method to measure MIL-M-38510 packages. Computer simulation, IR and electrical measurements were evaluated and compared for special thermal test packages. A ratio of about 5:1 was shown to exist for the junction peak, average and region temperature rise. Measurements can be misleading without proper interpretation. The optimum method, IR measurement of a coated chip, can measure only the junction region thermal resistance.

Descriptors :   *Packaged circuits, Microelectronics, Microcircuits, Integrated circuits, Thermal resistance, Thermal properties, Response, Junctions

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE