Accession Number : ADA017736
Title : Basic Adhesion Mechanisms in Thick and Thin Films.
Descriptive Note : Quarterly technical rept. no. 1, Jan-31 Mar 75,
Corporate Author : RCA LABS PRINCETON N J
Personal Author(s) : Bube,Kenneth R. ; Hitch,Thomas T.
Report Date : 30 APR 1975
Pagination or Media Count : 37
Abstract : During this quarter silver and gold powders were obtained for model ink studies. These consisted of a flake silver and spherical and mixed sphere and platelet gold powders. In addition, a copper powder was produced by direct reduction of copper oxide powder at low temperature, e.g., 150C. All powders have been partially characterized with respect to chemical purity and morphogical attributes, e.g., shape and size distribution. The degree of sintering in metal powder compacts has been established as a function of firing temperature. Except for copper, all of the powders showed significant shrinkage when fired at 600C. Glass-ceramic and glass-metal wetting behavior was studied by measuring glass sessile-drop contact angles as a function of firing temperature and time. In all cases, glass preferentially wetted the metal, e.g., gold, silver, or copper vs 96% Al2O3 substrates.
Descriptors : *Electric conductors, *Ceramic materials, *Metallizing, *Adhesion, Powder metals, Sintering, Shrinkage, Thin films, Thick films, Substrates, Glass, Wetting, Gold, Silver, Copper, Alumina, Firing, Microelectronics
Subject Categories : Electrical and Electronic Equipment
Coatings, Colorants and Finishes
Distribution Statement : APPROVED FOR PUBLIC RELEASE