Accession Number : ADA018170

Title :   Thermal Analysis of the RFSS Switch Driver.

Descriptive Note : Technical rept.,

Corporate Author : ARMY MISSILE RESEARCH DEVELOPMENT AND ENGINEERING LAB REDSTONE ARSENAL ALA GUIDANCE AND CONTROL DIRECTORATE

Personal Author(s) : Nieberlein,Vernon A.

Report Date : 18 SEP 1975

Pagination or Media Count : 23

Abstract : Overheated microelectronic circuits caused some equipment failures in a device known as the RFSS switch driver. A thermal analysis was made of this equipment using the CINDA computer code, and the mathematical model was validated by thermocouple readings. The effect of package material and the effect of convective cooling fins were calculated and the results are presented in graphic form. Recommendations are made for improving the dissipation of heat.

Descriptors :   *DRIVES(ELECTRONICS), *MICROCIRCUITS, THERMAL ANALYSIS, SWITCHING CIRCUITS, HEAT TRANSFER, FAILURE(ELECTRONICS)

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE