Accession Number : ADA113082

Title :   Leadless Chip Carrier Packaging and CAD/CAM-Supported Wire Wrap Interconnect Technology for Subnanosecond ECL.

Descriptive Note : Interim rept. 1 Jul 80-30 Jun 81,

Corporate Author : MAYO CLINIC ROCHESTER MN SPECIAL PURPOSE PROCESSOR DEVELOPMENT GROUP

Personal Author(s) : Gilbert,Barry K

PDF Url : ADA113082

Report Date : Nov 1981

Pagination or Media Count : 222

Abstract : This report describes the results of work conducted to develop rapid methods for designing and prototyping high-speed digital processor systems using subnanosecond emitter coupled logic (ECL). In Task I, we have begun a conversion of the design rules, interconnection protocols, special components, and standard logic panels developed during the first year for high-speed ECL-based digital processors from a technology based upon dual-in-line packages (DIP) to a technology based upon specially designed leadless ceramic chip carriers. This conversion was undertaken since it was learned during the first year that the DIP packages themselves are compromising the maximum performance levels of which the ECL dice are capable. We have also undertaken an extensive investigation of several possible approaches to increasing these operational maxima to an even greater extent than with our present design for new Leadless Ceramic Chip Carriers. Task 2 was to continue development of a comprehensive computer-aided design/computer-aided manufacturing (CAD/CAM) software package which would be specifically tailored to support the peculiar design requirements of processors operating in a high clock rate, transmission line environment. The CAD/CAM software package has been structured to be sufficiently flexible to assimilate advances in device and component technology, and to accept new sets of design rules resulting from advances in engineering design practice.

Descriptors :   *Chips(Electronics), *Packaging, *Digital computers, Computer programs, Prototypes, Experimental design, Processing equipment, Logic circuits, High velocity, Ceramic materials, Charge carriers, Specifications, Transmission lines, Environments, Wire winding machines

Subject Categories : Electrical and Electronic Equipment
      Computer Programming and Software
      Computer Hardware

Distribution Statement : APPROVED FOR PUBLIC RELEASE