Accession Number : ADA117979

Title :   Finite Element Analysis of Microelectronic Packages.

Descriptive Note : Final technical rept.,

Corporate Author : HARRIS CORP MELBOURNE FL GOVERNMENT INFORMATION SYSTEMS DIV

Personal Author(s) : Southland,J R ; Beatty,V R ; Vitaliano,W J

PDF Url : ADA117979

Report Date : May 1982

Pagination or Media Count : 224

Abstract : New and innovative methods are being applied to the analysis of the mechanical integrity of microelectronic packages. This study resulted in 1) a summary of commercially available finite element computer programs for both structural and thermal analyses, 2) a categorization of microelectronic problems that can be evaluated using analytical techniques, 3) assessment of applicable analysis techniques, 4) cost comparisons of exposing failure modes by the use of computer analysis rather than physical test, and 4) to provide engineers with a base of technical knowledge necessary for the application of the finite element technique to solve microelectronic reliability problems. (Author)

Descriptors :   *Microelectronics, *Computerized simulation, *Finite element analysis, Structural analysis, Thermal analysis, Reliability, Failure, Computer programs, Mechanical properties

Subject Categories : Electrical and Electronic Equipment
      Computer Programming and Software

Distribution Statement : APPROVED FOR PUBLIC RELEASE