Accession Number : ADA134095
Title : Laser Photodeposition and Photoetching Study.
Descriptive Note : Progress rept. 1 Jan-31 Mar 83,
Corporate Author : MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB
Personal Author(s) : Ehrlich,D H
PDF Url : ADA134095
Report Date : 31 Mar 1983
Pagination or Media Count : 29
Abstract : Work during this quarter has developed a new technique for direct-write etching of Al and Al:Si:Cu alloys, and has applied this new process to correction of bridging faults in VLSI signal-processing circuits. Additional work has expanded upon two excimer-laser resist processes to develop fast deep-UV lithographic procedures based on these powerful UV sources. A final series of experiments has extended pulsed UV-laser reactions to area photodeposition of Al203 films.
Descriptors : *Aluminum alloys, *Etching, *Lasers, *Integrated circuits, Silicon alloys, Copper alloys, Ultraviolet radiation, Pulsed lasers, Photolithography, Films, Deposition
Subject Categories : Electrical and Electronic Equipment
Lasers and Masers
Solid State Physics
Distribution Statement : APPROVED FOR PUBLIC RELEASE