Accession Number : ADA134095

Title :   Laser Photodeposition and Photoetching Study.

Descriptive Note : Progress rept. 1 Jan-31 Mar 83,

Corporate Author : MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB

Personal Author(s) : Ehrlich,D H

PDF Url : ADA134095

Report Date : 31 Mar 1983

Pagination or Media Count : 29

Abstract : Work during this quarter has developed a new technique for direct-write etching of Al and Al:Si:Cu alloys, and has applied this new process to correction of bridging faults in VLSI signal-processing circuits. Additional work has expanded upon two excimer-laser resist processes to develop fast deep-UV lithographic procedures based on these powerful UV sources. A final series of experiments has extended pulsed UV-laser reactions to area photodeposition of Al203 films.

Descriptors :   *Aluminum alloys, *Etching, *Lasers, *Integrated circuits, Silicon alloys, Copper alloys, Ultraviolet radiation, Pulsed lasers, Photolithography, Films, Deposition

Subject Categories : Electrical and Electronic Equipment
      Lasers and Masers
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE