Accession Number : ADA137372
Title : Impact of Electrostatics on IC (Integrated Circuit) Fabrication.
Descriptive Note : Final rept. Jan-Sep 83,
Corporate Author : RELIABILITY ANALYSIS CENTER GRIFFISS AFB NY
Personal Author(s) : Denson,W K ; Turner,T
PDF Url : ADA137372
Report Date : Sep 1983
Pagination or Media Count : 39
Abstract : Integrated circuit fabrication processes inherently involve materials with a high propensity of triboelectric charge generation. This report details the results of a study in which the intent was 1) to determine how electrostatic charges can catastrophically dame integrated circuits during their fabrication and 2) to investigate the effect these charges have on individual fabrication processes. Possible reliability implications of the presence of electric charges during fabrication are also hypothesized. An experiment was also carried out to determine the susceptibility of IC's in wafer form. In these tests, devices were stressed at various levels and then electrically tested to determine their functionality. Additionally, the susceptibility modes of devices in wafer form were compared to those in packaged form.
Descriptors : *Integrated circuits, *Electrostatics, *Fabrication, Triboelectricity, Electrostatic charge, Electric discharges, Processing, Wafers
Subject Categories : Electrical and Electronic Equipment
Electricity and Magnetism
Distribution Statement : APPROVED FOR PUBLIC RELEASE