Accession Number : ADA137372

Title :   Impact of Electrostatics on IC (Integrated Circuit) Fabrication.

Descriptive Note : Final rept. Jan-Sep 83,

Corporate Author : RELIABILITY ANALYSIS CENTER GRIFFISS AFB NY

Personal Author(s) : Denson,W K ; Turner,T

PDF Url : ADA137372

Report Date : Sep 1983

Pagination or Media Count : 39

Abstract : Integrated circuit fabrication processes inherently involve materials with a high propensity of triboelectric charge generation. This report details the results of a study in which the intent was 1) to determine how electrostatic charges can catastrophically dame integrated circuits during their fabrication and 2) to investigate the effect these charges have on individual fabrication processes. Possible reliability implications of the presence of electric charges during fabrication are also hypothesized. An experiment was also carried out to determine the susceptibility of IC's in wafer form. In these tests, devices were stressed at various levels and then electrically tested to determine their functionality. Additionally, the susceptibility modes of devices in wafer form were compared to those in packaged form.

Descriptors :   *Integrated circuits, *Electrostatics, *Fabrication, Triboelectricity, Electrostatic charge, Electric discharges, Processing, Wafers

Subject Categories : Electrical and Electronic Equipment
      Electricity and Magnetism

Distribution Statement : APPROVED FOR PUBLIC RELEASE