Accession Number : ADA138006

Title :   Computer Modeling of Complete IC Fabrication Process.

Descriptive Note : Final rept. 16 Jun 80-15 Jun 83,

Corporate Author : STANFORD UNIV CA STANFORD ELECTRONICS LABS

Personal Author(s) : Dutton,R W

PDF Url : ADA138006

Report Date : Jan 1984

Pagination or Media Count : 83

Abstract : Process and device modeling, especially in two-dimensions, for the complete integrated circuit fabrication process is reported. New understanding of oxidation and diffusion effects in silicon are reported and new computer tools and techniques are discussed. Device simulation is coupled to process modeling and new results for both short- and narrow-channel devices are reported. Non-planar device simulators, both poisson and two-carrier capabilities, have been developed. New techniques have been developed for parameter extraction and measurements. (Author)

Descriptors :   *Computerized simulation, *Integrated circuits, *Fabrication, *Computer aided design, *Mathematical models, Diffusion, Oxidation, Silicon, Statistical analysis, Parameters, Extraction, Measurement, Manufacturing

Subject Categories : Electrical and Electronic Equipment
      Statistics and Probability
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE