Accession Number : ADA180112

Title :   Solid-State Threshold Accelerometer Chip.

Descriptive Note : Final rept. Sep 85-Mar 87,

Corporate Author : MOTOROLA INC SCOTTSDALE AZ GOVERNMENT ELECTRONICS GROUP

Personal Author(s) : Faraco,Lou ; Meyer,Al

PDF Url : ADA180112

Report Date : 28 Mar 1987

Pagination or Media Count : 100

Abstract : Micromechanical cantilever beam structures having a maximum length of 0.16 in. were designed, fabricated, and tested in six configurations for use as threshold acceleration sensors for projectile fuzes. Their small size and ability to be produced using monolithic fabrication techniques commonly used to make integrated circuits provides the possibility of incorporating multiswitch arrays into a single die surface area one hundredth of a square inch. Design, fabrication, and test details are provided for two triple-beam arrays of cantilever structures made from 3-micrometer-thick silicon dioxide. (Author)

Descriptors :   *CANTILEVER BEAMS, *PROJECTILE FUZES, *SWITCHES, ACCELEROMETERS, CHIPS(ELECTRONICS), DIES, FABRICATION, INTEGRATED CIRCUITS, METHODOLOGY, MONOLITHIC STRUCTURES(ELECTRONICS), SOLID STATE ELECTRONICS, STRUCTURES, SURFACES, THRESHOLD EFFECTS, SOLID STATE PHYSICS, COMPUTER AIDED DESIGN

Subject Categories : Ammunition and Explosives
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE