Accession Number : ADA182360

Title :   VLSI/VHSIC (Very Large Scale Integrated/Very High Speed Integrated Circuits) Package Test Development.

Descriptive Note : Final rept. Dec 83-Dec 85,

Corporate Author : RAYTHEON CO BEDFORD MA MISSILE SYSTEMS DIV

Personal Author(s) : Clark,Kay E

PDF Url : ADA182360

Report Date : Dec 1986

Pagination or Media Count : 248

Abstract : The test methods of MIL-STD-883 were reviewed to assess their appropriateness in view of the new package styles and materials being used for BLSI/VHSIC devices. Experiments were performed to judge the effectiveness of existing tests. Changes to existing tests are proposed where deemed necessary and new tests are developed where no existing method adequately assess new technology devices. Proposed changes and/or new package tests evaluate: solderability of leads; pin grid lead pull strength; leadless chip carrier bond strength; die attach bond analysis; characteristic impedance, capacitance, and delay time of high speed signals; crosstalk; and flip-chip pull strength. Keywords include: Very Large Scale Integrated and Very High Speed Integrated Circuits (VLSI/VHSIC), Hugh I/O Count Packages, and Microcircuit Packages.

Descriptors :   *CHIPS(ELECTRONICS), *FLIP CHIPS, *PULL TESTS, *MICROCIRCUITS, BONDING, BONDED JOINTS, STRENGTH(MECHANICS), DELAY, TIME, SIGNALS, CAPACITANCE, CROSSTALK

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE