Accession Number : ADA184167
Title : Bond Character at a Silicon/Copper Surface.
Descriptive Note : Technical rept.,
Corporate Author : PENNSYLVANIA UNIV PHILADELPHIA DEPT OF PHYSICS
Personal Author(s) : Patterson,C H ; Plummer,E W ; Messmer,Richard P
PDF Url : ADA184167
Report Date : Dec 1986
Pagination or Media Count : 2
Abstract : The ionic and covalent character of bonding is considered for the Si (111)-(5x5) Cu phase formed when one monolayer of copper is deposited on Si(111)(7x7) and subsequently annealed to 600C. Localized orbitals and ab initio calculations have been employed to evaluate total energies and types of bonding for Cu adsorbed in several different sites, including the structure proposed by Chambers et al (1) on the basis of their angle resolved Auger electron spectroscopy results. The relation between the bond character of this phase and its surface spectroscopic properties is discussed.
Descriptors : *BONDING, *COPPER COATINGS, *SILICON, AUGER ELECTRON SPECTROSCOPY, COPPER, LAYERS, SURFACES
Subject Categories : Inorganic Chemistry
Distribution Statement : APPROVED FOR PUBLIC RELEASE