Accession Number : ADA186875

Title :   Development of Methods for Low Temperature Diffusion Bonding.

Descriptive Note : Master's thesis,

Corporate Author : NAVAL POSTGRADUATE SCHOOL MONTEREY CA

Personal Author(s) : Muffler, Paul A

PDF Url : ADA186875

Report Date : Sep 1987

Pagination or Media Count : 39

Abstract : An apparatus for low temperature diffusion bonding of dissimilar metals has been developed. Experiments varying the bonding temperature at constant pressure and time were conducted utilizing type 316 stainless steel samples coated with a layer of silver in order to verify the design of the apparatus and the bonding procedures. The Scanning Electron Microscope (SEM) was used to illustrate the effects of temperature variation on the microstructure of the bonds produced. The results showed diffusion bonds of silver to silver to be possible at all three temperatures used. Recrystallization and or grain growth in the silver coating occurred at the bond interface at 300 C and the entire coating was beginning to recrystallize and undergo grain growth at 400 C after 30 minutes at 20,000 psi (137.9 MPa). The experiments successfully demonstrated the capability of the apparatus, but much more development of the bonding procedure is required. Keywords: Low temperature, Methods of diffusion, Bonding, Solid, State bonding, or Diffusion welding.

Descriptors :   *DIFFUSION BONDING, *SILVER, *LOW TEMPERATURE, *STAINLESS STEEL, BONDED JOINTS, ELECTRON MICROSCOPES, ELECTRONIC SCANNERS, GRAIN GROWTH, INTERFACES, LAYERS, MICROSTRUCTURE, PRESSURE, RECRYSTALLIZATION, SILVER, TEMPERATURE, VARIATIONS, METAL COATINGS, TENSILE STRENGTH, THERMOCOUPLES, SURFACE ROUGHNESS, DEPOSITION, NICKEL, COPPER, INDUCTION HEATING, FATIGUE(MECHANICS), CRACKS, THESES

Subject Categories : Properties of Metals and Alloys
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE