Accession Number : ADA189666
Title : Advanced Packaging for VLSI/VHSIC (Very Large Scale Integrated Circuits/Very High Speed Integrated Circuits) Applications: Electrical, Thermal, and Mechanical Considerations - An IR&D Report.
Descriptive Note : Technical memo.,
Corporate Author : JOHNS HOPKINS UNIV LAUREL MD APPLIED PHYSICS LAB
Personal Author(s) : Clatterbaugh, G V ; Charles, H K , Jr
PDF Url : ADA189666
Report Date : Nov 1987
Pagination or Media Count : 94
Abstract : A comprehensive study of advanced packaging methods for VLSI and VHSIC applications has been performed. Particular emphasis has been placed on the analytical tools necessary for the modeling and performance simulation (electrical, thermal and mechanical) of complex high performance microelectronic packaging structures. The models have been validated by extensive experimental testing. Packaging and board level performance has been evaluated for various digital logical families including. TTL, ECL and HCMOS. Design guidelines have been developed that can be used by circuit engineers to extract the maximum performance from the devices on various board techniques including multilayer ceramic and organic printed wiring boards. Both surface mounting and through hole mounting have been considered, including methods for designing optimum soldered interconnects for each operational scenario.
Descriptors : *MATHEMATICAL ANALYSIS, *PACKAGING, *SIMULATION, METHODOLOGY
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE